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Cutting

Cutting

Supports cutting of hard and brittle materials with abundant equipment and cutting technology

 

Based on abundant equipment and past ceramic processing experience, we can handle hard materials such as SiC (silicon carbide) and brittle materials such as aluminum nitride. We also have a lot of experience in processing parts that require precision such as electronic and optical materials.

Processing method

Dicer Cut Processing

It can be mounted on a dicing tape that matches the product and processing conditions, and can be used for dicing cutting, highly accurate alignment cutting according to the pattern, bevel cutting, and grooving.


Work Size
Maximum: φ260mm × t0.5mm(High torque dicer φ300mm × t3.0mm)
Minimum cutting dimension: 0.2mm　Cutting accuracy: ±0.01mm

Main processing materials
Alumina, aluminum nitride, barium titanate, glass material, silicon wafer, glass epoxy resin substrate, piezoelectric ceramics
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Multi-wire Saw Cut Processing
Can cut hard materials such as sapphire and SiC

Work Size
Maximum: φ200 × L300mm Minimum cutting size: 0.15mm
Cutting accuracy: ±0.01mm Cutting allowance: 0.18mm
Remarks: Depending on the processing material and work size,
We will process according to the customer's required specifications.

Main processing materials
Ceramics, glass, functional crystals, quartz, composite materials, hybrid materials, sapphire, cemented carbide
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Slicer Cut Processing

We can bond with WAX that matches the product and processing conditions, and can also handle strip cutting, individual piece cutting, deep grooving, and wide grooving according to the pattern and product edge.


Work Size
Maximum: 250 x 160 x 15.0 mm Minimum cutting dimensions: 0.5 mm
(Deep groove specification slicer t40.0mm grooving depth 35.0mm available)
Cutting accuracy: ± 0.01 mm ~

Main processing materials
Alumina, aluminum nitride, glass material, piezoelectric ceramics
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Click here for details

Dicer processing site

Multi-wire saw processing site

Multi-wire saw processing (Headquarters / Mitsuke)
Multi-wire saw processing (Headquarters / Mitsuke)

Slicer processing site

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