Polishing

High flatness and smoothness are required for high-performance materials such as optical elements and electronic device elements to promote high precision, ultra-miniaturization, and high integration. Sinko Co., Ltd. meets all needs from trial production to mass production of high-precision polishing of various brittle materials.

Processing method

Wrapping Processing (Double-sided Polishing)

Polishing process that leads to shortening of lead time and cost without bonding / peeling process

: Corresponding work size : ~ Φ100mm (□ 100mm), t0.05mm ~; Machining accuracy : ±0.001mm~ Surface roughness : Ra> 0.10 μm

Main processed materials: Ceramics, glass, functional crystals, quartz, composite materials, hybrid materials, sapphire, cemented carbide

Click here for details