Dicer Cut Processing
Features of cutting process
Cutting is a method of cutting and molding an object, and it can be processed with high accuracy by selecting an appropriate method.
We use diamond blades, diamond wires, etc. to perform precision cutting that matches the object (material), and we also handle fragility, optical glass, and piezoelectric ceramics processing using the processing technology that we have cultivated so far.
12 inch square table specifications
Fully automatic dicer with twin spindles
12-inch square table can support up to □ 260 mm
It is possible to shorten the processing time by using a machine equipped with a twin spindle and to process bevel cut and cutting at the same time.
8-inch table semi-auto dicer
3-inch blade, 2-inch blade specifications
We can handle from trial production to mass production with a dicer with specifications that meet the conditions depending on the product. With a 3-inch high torque specification dicer, precision products with a thickness of 2 to 3 mm, which had been sliced until now, can also be handled with a dicer.
6-inch table semi-auto dicer
Supports cleaning after cutting by spin cleaning
Two-fluid cleaning and high-pressure cleaning can be used properly depending on the dirt and deposits on the product.
Frame size 6 inch specifications
Alignment to the chip tray is also available according to the customer's specifications.
Dicer processing site scenery
Work size and specifications
maximum | φ200mm × t2.0mm |
Minimum cutting dimensions | 0.3mm and up |
Cutting accuracy | ±0.01mm |
Cutting allowance | 0.05mm and up |
Grooving (V groove, U groove, square groove) | ・ We will process it to the desired groove width and shape.Please specify the size such as pitch width and groove depth. ・ U-grooves and square grooves can be supported by selecting various blades. |
Ridge chamfering | ・ Chamfer the ridgeline of the product after cutting. -The chamfer width can be set arbitrarily. -Since it is processed without touching the product directly, it is also possible to handle film-formed products. |
Processing material | Ceramics, alumina, zirconia, PZT, aluminum nitride (ALN), bismastellu, LTCC, barium titanate, strontium titanate, glass, crystal, silicon carbide (ceramic, single crystal), quartz, sapphire, resin |
