Multi-wire Saw Cut Processing
Fine high-precision cutting that minimizes work damage
Since it cuts free abrasive grains, it is a cutting process that minimizes damage to the work.
Because the cutting allowance is extremely small, around 0.20 mm, it has a high material yield and excels at fine, high-precision cutting of expensive crystalline materials.
We have a wide range of models from small models to models that support up to 12 inches, so we can meet a variety of needs from high-mix small lots to mass production.
Because the cutting allowance is extremely small, around 0.20 mm, it has a high material yield and excels at fine, high-precision cutting of expensive crystalline materials.
We have a wide range of models from small models to models that support up to 12 inches, so we can meet a variety of needs from high-mix small lots to mass production.
Work size and specifications
maximum | Φ300mm x L300mm |
Minimum cutting dimensions | 0.15 mm |
Cutting accuracy | ±0.01mm and up |
Cutting allowance | 0.21mm and up |
Processed shape | Multi-cutting / dicing cutting / wafer processing We respond to the shape requested by our customers. |
Processing material | Ceramics (zirconia, PZT, aluminum nitride (AlN), bismuth telluride, barium titanate, strontium titanate), glass, functional crystals (LN, Si), quartz |
