Wrapping Processing (Double-sided Polishing)
Polishing process that leads to shortening of lead time and cost without bonding / peeling process
We perform high-precision polishing of various ceramics, single-crystal materials, optical glass, quartz, and other materials used in electronic components.
We own 4B-9B models and have a wide range of polishing carriers, so we can respond flexibly depending on the processing quantity.
In addition, the surface roughness can be adjusted by the type and count of the abrasive.
You can consult with us about the processing method according to your specifications and materials.
Work size and specifications
Work Size | ～ φ100mm (□ 100mm), t0.05mm ～ |
Machining accuracy | ±0.001mm and up |
Surface roughness | Ra> 0.10 μm |
Processing material | Ceramics (silicon nitride (SiN)), alumina, zirconia, aluminum nitride (ALN), barium titanate, strontium titanate, glass, silicon carbide (ceramic, single crystal), quartz, sapphire |
